这款型号为BCM23550的四核处理器据该公司移动和无线集团移动平台业务资深市场总监Michael Civiello介绍，BCM23550基于四核ARM Cortex-A7架构，单核主频1.2GHz;采用的是自家的集成了VideoCore IV 技术的GPU，具备高性能图形处理能力，可以很好地支持3D游戏和其他有大量图像的应用程序，而且在功耗管理上效能显著。VideoCore 多媒体技术还可以很好地支持“dual HD”功能，即双高清显示，用户可以把手机中的高清内容通过Miracast同步传送到更大的显示屏上观看，在流畅性和响应速度上可以做到无延时同步显示，丝毫不影响用户体验。在拍照、摄影等多媒体应用上，该芯片集成了图像信号处理器（ISP）可支持高达1200万像素摄像头和许多高级成像功能，例如眨眼和微笑检测、人脸追踪、红眼消除、快速拍摄（快速捕捉）、零快门延迟、选择最佳照片等，以及高质量H.264全高清（1080p@30fps）摄像机和视频回放。

         BCM23550有一个显著地特点，就是它是业内首个整合了5G WIFI、NFC、GPS和室内定位功能的四核平台。它通过与5G WIFI、多卫星GNSS以及高级室内定位技术相结合，能够在室内和室外实现无处不在的定位。Civiello解释了具体定位功能的实现方式：首先手机与基站相连，这样就能知道用户所在的大体位置，一旦知道这个位置，就可以针对这个区域搜索其上空的卫星而不是搜索所有的卫星来实现定位，大大节省了时间；如果进入建筑物中，由于建筑物内的每个WIFI路由器都有一个独特的MAC地址，具体固定的位置，根据这个MAC地址就可以知道用户大体的位置，知道了大致位置后，后面可以再利用NFC、低功耗蓝牙、MEMS等技术进行来更精确的定位。

         总体来说，BCM23550集成了蜂窝基带、触摸屏控制器、PMU、PFIC以及WIFI、蓝牙、NFC、GPS以及高级室内定位功能等多个模块，是一款高性能、功能丰富的四核解决方案。在服务模式上，博通也开始提供Turnkey服务。该平台主打终端价位在999~1399元人民币之间的市场，具体配置可由系统厂商确定，这对于众多国内手机厂商来说确实是一个不错的选择。BCM23550与博通之前推出的双核HSPA+平台BCM21664T管脚兼容，对于已经在其双核平台上进行的产品开发的手机制造商来说，可以很轻松的利用现有设计方案进行升级，大大缩短四核产品上市时间。

        据介绍，作为新一代半导体器件，IGBT是自动控制和功率变换的关键核心部件，被广泛应用在轨道交通装备行业、电力系统、工业变频、风电、太阳能、电动汽车和家电产业中。此前，国内高端IGBT芯片基本依赖进口。此次大功率IGBT芯片的研制成功，不仅可以为我国高铁、动车组等轨道交通装备及其他相关行业提供强劲的“中国芯”，还将逐步改善国内目前大功率IGBT全部依赖进口的状况，降低我国轨道交通发展成本。目前，中国已成为全球最大的IGBT芯片消费国，年需求量超75亿元，每年还以30%以上的速度增长，到2020年，中国仅轨道交通电力牵引产业每年IGBT芯片的市场规模将不低于10亿元，智能电网不低于4亿元。据介绍，加上中国北车，目前世界上掌握这项技术的企业只有四家。

上海市集成电路行业协会高级顾问王龙兴指出，税赋优惠是中国大陆半导体产业蓬勃发展的重要助力。

上海市集成电路行业协会高级顾问王龙兴表示，中国大陆政府为全力扶持本土半导体产业，已祭出半导体设备、IC设计、晶片制造等企业获利前2年免税，及第3年税金减半的优惠措施，以减轻高科技产业在初期研发投资亏损的压力，因而让中国半导体产业得以向上发展。

除政策加持外，中国大陆对行动装置的需求愈来愈高，也成为推升中国大陆半导体产业发展蓬勃的关键动能。王龙兴进一步指出，现今中国大陆消费市场商机已跃居全球第一，无论是智慧型手机、平板电脑或笔记型电脑每年需求量都不断增长，带动中国大陆半导体整体产值在2006～2012年之间，从人民币1,006.3亿元，提升至人民币2,185.5亿元。

根据上海市集成电路行业协会最新报告分析，中国大陆半导体产业于2006～2012年的年复合成长率(CAGR)达18.8%；其中，IC设计产业年复合成长率为25.7%，晶片制造部分为15.4%，封装测试方面则为17.6%，预估2013年与2014年皆可望持续成长。

据了解，目前中国大陆半导体产业共有长江三角洲、京津环渤海湾、珠江三角洲与中西部地区等四大聚落；其中，长江三角洲内的上海半导体产业园区由于产业链体系较为完整，因此为中国大陆最重要的半导体发展核心地带，且此一园区的半导体产值约占整体中国大陆半导体产值31%。

王龙兴补充，上海半导体产业园区在2011年经历密集的建设后，2012年已进入高技术性、高生产能力的阶段，未来此一产业园区还会新增张江高新区、漕河泾开发区、紫竹科学园区，并列为积极落实发展重点，可望再次扩大上海半导体产业园区的影响力。

然而，尽管中国大陆半导体产业正快速发展，但整体技术层次与国际水准相比仍有一段距离。王龙兴坦言，目前中国半导体产业在制程技术确实较国际半导体水准落后，正努力迎头赶上，预估2015年时，中国大陆IC设计技术水准可望达到22/20奈米，而封装技术也可望进入国际主流领域，并扩展Flip Chip、BGA、CSP、WLP以及MCP等先进封装形式的产能比例。

        另外，LAPIS Semiconductor已开始销售评估套件并开设了技术支持网站。在该网站中，不仅可以下载最新的技术规格书、手册，还可下载参考板电路图和示例应用程序的源代码。

        最近，智能手机、平板终端、笔记本电脑等移动终端不仅支持Bluetooth® SIG注1所倡导的Bluetooth®，而且Bluetooth® Low Energy也日益普及。主要移动终端用的OS官方都已表明支持态度，预计未来上市的很多终端都会同时支持Bluetooth®与Bluetooth® Low Energy。

        伴随着这种趋势，在通过智能手表、保健器材、健身器材等与智能手机和平板电脑终端之间的联动来提高便利性的设备中，也正在加速Bluetooth® Low Energy的普及。而这些多为电池驱动的设备，为了延长电池寿命，实现更低功耗成为当务之急。

        LAPIS Semiconductor去年推出的“ML7105”，实现了业界顶级的低耗电量（收发数据包时的运行状态）。此次开发出的新品“ML7105-00x”，不仅保持了运行状态下的低耗电量性能，而且平均电流还减少了一半。所谓平均电流，是指按一定间隔反复收发数据包时的运行状态（耗电量大）与休眠状态（耗电量小）的平均电流值。通过大幅减少改变状态所需的时间，使平均电流减半，从而使电池寿命可达2倍。因此，按LAPIS Semiconductor的工况条件，支持Bluetooth® Low Energy的、使用纽扣电池（CR2032）的设备其电池寿命即使在24小时连续工作的条件下，也可充分使用2年。

           中国的半导体消费量已经增长到历史最高水平，现在占全球半导体市场一半以上。普华永道最新发布的《2013 半导体市场——中国新势力》报告表明，随着2012 年8.7％的增长，中国目前的半导体消费量占全球总消费量的52.5％。

           中国半导体消费的增长，与全球半导体市场相比，形成了一个显著的对比。全球半导体市场在2012 年整体下降了3％。

           全球电子设备生产大量转移到中国，而且在这些电子设备生产中所用的半导体含量要高于世界平均水平，这导致了中国半导体消费的增长。在2012 年，中国电子设备生产占全球的百分比上升了2 个百分点，达到了34.2％，到2017 年预计将上升至40％以上。

           普华永道全球科技及半导体行业主管合伙人Raman Chitkara 表示：“中国的半导体消费主导地位不断增强主要归功于其智能手机和平板电脑市场的迅速增长，这两样产品都是主要在中国生产。在可预见的未来，预计中国将继续其半导体消费的领导地位，到2017 年其市场份额可能达到60％。”

           普华永道报告中的重要发现包括：行业增长：中国半导体产业增长了9.6％，达到563 亿美元。

          集成电路（IC）产业拥有重大影响：中国IC 产业（包括IC 设计，IC 晶圆制造，IC 封装和测试）是2012 年中国半导体消费增长背后的主要驱动力。以上三个产业在2012 年都取得了双位数的增长。

           IC 设计增长最快：中国的IC 设计仍然是中国半导体产业增长最快的产业在2012 年增长了21％。

           半导体封装，组装和测试能力（SPA＆T）在中国继续增长，而在其他地方萎缩：2012年，中国的净生产场地面积增长了5％，该指标近似于生产能力，而在同一时期，世界其他地方的净生产场地面积则减少了8.9％。

           未来的市场机会

           中国的半导体消费量继续超过其生产量，至2012年，之间的差距扩大了67亿美元，已经达到了1016亿美元。

           这种供求不平衡，带来了巨大的市场机会。但是，目前还不清楚，这一缺口将由跨国半导体公司在中国扩大生产量进而填补，或者由中国公司持续发展来应对这一挑战。

           普华永道中国科技行业主管合伙人高建斌说： 普华永道中国科技行业主管合伙人高建斌说：普华永道中国科技行业主管合伙人高建斌说： 普华永道中国科技行业主管合伙人高建斌说： 普华永道中国科技行业主管合伙人高建斌说： 普华永道中国科技行业主管合伙人高建斌说： “自 2000年以来，中国一直不断加强其其 IC设计能力，令IC设计产业为IC产业中唯一每年都取得收入同比增长的部门，我们预计这一趋势还将继续。同时，有了这些坚实的基础，中国主要半导体厂家，在雄心勃勃的政府激励计划和风险资本投资的支持下，将会充分利用尚未开发的市场潜力。”

我司携供应商RivieraWaves也一同参加了此次盛会。

“通过推出像DTS Neural Surround这样的用于下一代汽车音频处理器的、全新的、经过大幅优化的、创新的音频解决方案，并在测试方面大力投入以确保产品的坚固性和高品质，Cadence不断扩大其在Tensilica HiFi Audio/Voice DSP上的领先地位，”DTS产品和平台高级副总裁Geir Skaaden表示。“我们在HiFi架构上拥有长期经验，推出了从超低功耗到高性能应用的一系列产品。”

“我们看到客户和OEM厂商越来越需要对DTS解码器和音频解决方案的支持，包括最新的DTS Neural Surround，从而在家庭和汽车娱乐中实现环绕声体验的增强，”Cadence主管IP集团的公司副总裁Jack Guedj表示。“近来众多体育和音乐转播包括滚石音乐会和2013超级碗杯都是采用DTS Neural Surround进行转播的，这样能确保观众获得最高品质的音效。”

DTS Neural Surround技术采用了先进的方法将最多7.1声道输入音频编码为立体声，同时保留着来自分立式数字多声道音轨的环绕声队列。然后双声道音频可以采用立体声进行播放，或在带有Neural Surround功能的用户端产品上被转换回最高7.1声道，提供目前尽可能接近原始分立式多声道音频的听觉体验。

SAN JOSE, Calif. (November 7, 2013) — PLDA, the industry leader in PCI Express® and interface IP solutions, today announced QuickPCIe Lite IP for FPGA, offering the industry’s only solution for a plug and play PCIe experience. PLDA’s innovative QuickPCIe Lite product is designed to work directly “out of the box” and does not require a customer to manipulate PCIe concepts, whether at the hardware or software level. The IP is pre-configured for optimal performance and resource utilization, while guaranteeing timing closure on medium speed grade devices at up to Gen3 x8 speed.

 PLDA’s QuickPCIe Lite IP offers streamlined support across 7-Series FPGAs from Xilinx and V-Series FPGAs from Altera and delivers full PCIe coverage, from Gen1 x1 to Gen3 x8. In addition, it offers:

A universal streaming interface, enabled both in hardware through AXI4 streaming for Xilinx FPGAs and Avalon streaming for Altera FPGAs, and in software via a simple API
Full compatibility with Altera Qsys  and Xilinx IPI design methodologies
A cost–effective and footprint optimized solution
Seamless migration between supported Altera and Xilinx FPGAs 
An ultra-simple software API, enabling effortless integration in customer applications
 “PLDA’s QuickPCIe Lite is a true revolution in the way IP is integrated by our customers”, stated Stephane Hauradou, CTO of PLDA.  “Unlike competing products, QuickPCIe Lite enables customers with absolutely no PCIe background to integrate the IP quickly and seamlessly”. Hauradou added “QuickPCIe Lite really redefines the traditional PCIe design model by abstracting complicated mechanisms such as DMA and scatter-gather”.

SAN JOSE, Calif. (Oct 1, 2013) — PLDA, the industry leader in PCI Express® and interface IP solutions, announced enhanced support of SR-IOV (single root I/O virtualization) within their XpressRICH3 PCI Express Gen3 IP solution, enabling customers to deploy virtualized applications more quickly and efficiently directly from within the PCI Express interface. The PLDA soft IP solution with SR-IOV capability is available for ASIC and FPGA and has been extensively tested on PLDA leading edge FPGA boards. The solution provides up to Gen3 x16 support, making PLDA the PCIe Gen3 IP of choice for leading ASIC and FPGA designs.

PLDA's XpressRICH3 with SR-IOV support enables native SR-IOV within the PCIe interface. Each PLDA PCI Express device can have up to eight physical functions (PFs) and each physical function can have up to 64 virtual functions (VFs). Each virtual function is seen by software as a separate PCI Express device, enabling several devices in the same chip and easing software development cycles.

Devices that have SR-IOV capability provide the following benefits:

Higher levels of performance by enabling direct access to hardware from the virtual machine environment
Cost reductions through power savings, reduced adapter count, less cabling and fewer switch ports
"This announcement expands PLDA’s leadership in PCIe Gen3 IP solutions, ensuring leading virtualized system providers can more effectively deploy virtualization by leveraging the SR-IOV functionality from within the PCIe fabric." said Stephane Hauradou, CTO for PLDA.

Product Availability

PLDA’s XpressRICH3 IP with enhanced SR-IOV support is currently available for purchase.

About PLDA

PLDA designs and sells intellectual property (IP) cores and prototyping tools for ASIC and FPGA that aim to accelerate time-to-market for embedded electronic designers. PLDA specializes in high-speed interface protocols and technologies such as PCIe, and Ethernet. PLDA provides IP cores with a complete set of tools, including FPGA prototyping cards or System-on-Module components, drivers and APIs and testbenches. Their products benefit from a global support and sales organization able to sustain over 2,000 ASIC and FPGA customers worldwide. PLDA is a global company with offices in North America (San Jose, California) and in Europe (France, Italy).

PLDA, the industry leader in PCI Express® IP solutions and GUC, the Flexible ASIC LeaderTM , today announced successful test chips for the industry’s first combined PCIe Gen 3 Controller IP and PHY IP solution on TSMC 28nm HPM (High Performance Mobile) process. The combined PCIe 3.0 Controller/PHY solution is in initial production and has been incorporated into demo boards.

The TSMC 28nm HPM process offers significantly higher speeds, up to 40 percent lower power and better gate density compared to the 40nm node and is optimized for the requirements of high performance mobile devices. The ability to easily integrate a complete PCIe Gen 3 solution into end products is a significant milestone for developers of next generation mobile devices.

The PLDA XpressRICH3 IP is a high performance, low latency, highly-configurable PCI Express Endpoint, Root port, and Switch IP, compliant to the PCI Express rev.3.0 specification. It is also available with the industry-standard AMBA AXI4 interface under the version XpressRICH3-AXI .

GUC's PCIe Gen 3 PHY is designed for networking and high end computing SoC's.  Based on GUC’s proven high-speed SERDES technology, the performance of PCIe Gen 3 PHY exceeds PCI Express Base Specification rev.3.0 while proving highly adaptable to any link/lane configurations.

“PLDA’s XpressRICH3 IP improves upon the leading architecture and reliability of previous generations of PLDA PCI Express interface IP and provides the performance and configurability necessary to take advantage of the benefits provided by HPM, while improving the design process for its global customer base,” stated Stephane Hauradou, CTO for PLDA.

“The GUC PHY supports the PCI Express protocol and signaling for designers working on high end computing and networking applications,” said Dr. Jen-Tai Hsu, Senior Director of R&D, GUC. “Its low-power and industry-leading small footprint provide the state-of-the-art flexibility required for the innovative 28nm HPM process.”

Availability

PLDA XpressRICH3 IP is available now from PLDA. The PHY IP is available now from GUC.

Evaluation boards with a single chip with PLDA’s PCIe 3.0 Controller and GUC’s PCIe 3.0 PHY combination are available for review now. To request an evaluation board, please contact PLDA to request an evaluation.

About PLDA
PLDA designs and sells intellectual property (IP) cores for FPGA and System-on-Chip (SoC) that aim to accelerate time-to-market for embedded electronic designers. PLDA specializes in high-speed interface protocols and technologies such as PCIe, and Ethernet.
PLDA IP cores are provided with a complete set of tools, including FPGA prototyping cards, drivers and APIs, testbenches and benefit from a global support and sales organization able to sustain over 2,000 ASIC customers worldwide.

PLDA is a global company with offices in North America (San Jose, California) and in Europe (France, Italy). For more information visit www.plda.com.

About Global Unichip Corp.
GLOBAL UNICHIP CORP. (GUC) is the Flexible ASIC LeaderTM who provides the semiconductor industry with leading IC implementation and SoC manufacturing services.  Based in Hsin-chu Taiwan, GUC has developed a global reputation with a presence in China, Europe, Japan, Korea, and North America.  GUC is publicly traded on the Taiwan Stock Exchange under the symbol 3443.  For more information, visit www.guc-asic.com.
- See more at: http://www.plda.com/first-successful-pciegen-3-controller-and-phy-combination-tsmcs-28nm-0#sthash.EwbtM8cT.dpuf

 SAN JOSE, Calif. --  November 14, 2013 -- — PLDA, the industry leader in PCI Express® IP solutions and Fastor Systems, an innovative provider of Solid State Drives for enterprise and cloud applications, today announced the incorporation of PLDA’s PCIe IP with advanced built-in DMA into an upcoming Fastor Systems’ NVMe Solid State Drive.  

Fastor Systems’ architecture is the industry’s first and only fabric based SSD in the marketplace today.  The use of this non-blocking switch fabric has enabled a multitude of disruptive benefits resulting in a new generation of features and functions, or SSD 2.0.  These benefits include:

• Eliminates the bus contention inherent in all existing SSDs, and results in higher and more stable performance as well higher capacity and lower cost of ownership
• Allows the full performance potential of the Flash Memory to be unleashed, which is not possible in any controller-centric architecture
• Enables dramatic reductions in implementation cost and power consumption through SSD virtualization

The Fastor Systems NVMe SSD utilizes IP from PLDA to enable the high performance levels required within their PCIe subsystem. The PLDA IP provides an easy-to-use and fully configurable PCI Express interface IP with integrated multi-channel DMA.

 “The integration of PLDA’s silicon-proven IP within Fastor Systems’ solid state drive will result in a high-quality, integrated hardware and software solution and we are proud to be a part of its creation” stated Stephane Hauradou, CTO for PLDA.

According to Daniel Mahoney, CEO of Fastor Systems, “PLDA’s IP provides dramatic improvements in DMA performance in our PCIe interface block, allowing us to fully demonstrate the performance potential of our new architecture”. He added, “PLDA’s IP is well supported by their technical staff, and it will be an important element in the ultimate success of our product and the next generation SSD architecture which it embodies.”

Product Availability

• For information on Fastor Systems, their upcoming NVMe SSD release and their complete line of SSD solutions, visit them online at www.fastorsystems.com.
• PLDA provides several silicon-ready PCIe with DMA IP solutions for Xilinx and Altera FPGAs. All products are available now. For more information, please visit www.plda.com.

About PLDA

PLDA designs and sells intellectual property (IP) cores for FPGA and System-on-Chip (SoC) that aim to accelerate time-to-market for embedded electronic designers. PLDA specializes in high-speed interface protocols and technologies such as PCIe, and Ethernet.

PLDA IP cores are provided with a complete set of tools, including FPGA prototyping cards, drivers and APIs, testbenches and benefit from a global support and sales organization able to sustain over 2,000 ASIC customers worldwide.

PLDA is a global company with offices in North America (San Jose, California) and in Europe (France, Italy and Bulgaria). 

 About Fastor Systems

Fastor Systems is engaged in bringing future-proof solutions to the rapidly growing Cloud and Enterprise SSD markets. Fastor’s disruptive approach will provide customers with vastly enhanced application performance, reduced total cost of ownership and lower power consumption. Fastor’s advantages scale with each new interface standard, and are adaptable to all types of storage class memory media. Fastor represents the future of SSDs.